Micron Technology Inc.

NASDAQ: MU    
Share price (10/22/21): $67.51    
Market cap (10/22/21): $75.5 billion

Credit Agreements Filter

EX-10.23
from 10-Q 85 pages Term Loan Credit Agreement Among Micron Technology, Inc., as Borrower and the Lenders Party Hereto, and Wells Fargo Bank, National Association, as Administrative Agent Dated as of May 14, 2021 Oversea-Chinese Banking Corporation Limited, Los Angeles Agency, as Syndication Agent the Toronto-Dominion Bank, New York Branch the Bank of Nova Scotia, as Documentation Agents Wells Fargo Securities, LLC as Sole Bookrunner and as Sole Lead Arranger Credit Agricole Corporate and Investment Bank as Sustainability Structuring Agent
12/34/56
EX-10.22
from 10-Q 101 pages Credit Agreement Among Micron Technology, Inc., as Borrower and the Lenders Party Hereto, and Hsbc Bank USA, National Association, as Administrative Agent Dated as of May 14, 2021 Hsbc Securities (USA) Inc. as Sole Bookrunner Hsbc Securities (USA) Inc., Bnp Paribas Securities Corp., Credit Agricole Corporate and Investment Bank, Dbs Bank Ltd., Industrial and Commercial Bank of China Limited, New York Branch, Mizuho Bank, Ltd., Mufg Bank, Ltd., and Wells Fargo Securities, LLC as Joint Lead Arrangers Credit Agricole Corporate and Investment Bank as Sustainability Structuring Agent
12/34/56
EX-10.45
from 10-K 104 pages Incremental Amendment No. 2, Dated as of July 9, 2019 to the Credit Agreement, Dated as of July 3, 2018 Among Micron Technology, Inc., as Borrower, the Lenders Party Hereto, and Jpmorgan Chase Bank, N.A., as Administrative Agent and as Collateral Agent Wells Fargo Securities, LLC, Hsbc Securities (USA) Inc. and Jpmorgan Chase Bank, N.A., as Joint Lead Arrangers and Joint Bookrunners
12/34/56
EX-10.70
from 10-Q 10 pages Incremental Amendment No. 1, Dated as of November 27, 2018 to the Credit Agreement, Dated as of July 3, 2018 Among Micron Technology, Inc., as Borrower, the Lenders Party Hereto, and Jpmorgan Chase Bank, N.A., as Administrative Agent and as Collateral Agent Jpmorgan Chase Bank, N.A., as Lead Arranger and Bookrunner 1 Incremental Amendment No. 1
12/34/56
EX-10.68
from 10-K 81 pages Credit Agreement Among Micron Technology, Inc., as Borrower and the Lenders Party Hereto, and Jpmorgan Chase Bank, N.A., as Administrative Agent and as Collateral Agent Dated as of July 3, 2018 Jpmorgan Chase Bank, N.A. and Hsbc Securities (USA) Inc. as Joint Bookrunners
12/34/56
EX-10.77
from 10-Q 8 pages Fourth Amendment to the Credit Agreement Among Micron Technology, Inc., as Borrower and the Lenders Party Hereto, and Morgan Stanley Senior Funding, Inc., as Administrative Agent and as Collateral Agent Dated as of April 27, 2018 Morgan Stanley Senior Funding, Inc., as Lead Arranger and Bookrunner 1 Fourth Amendment
12/34/56
EX-10.73
from 10-Q 8 pages Third Amendment to the Credit Agreement Among Micron Technology, Inc., as Borrower and the Lenders Party Hereto, and Morgan Stanley Senior Funding, Inc., as Administrative Agent and as Collateral Agent Dated as of October 26, 2017 Morgan Stanley Senior Funding, Inc., as Lead Arranger and Bookrunner 1 Third Amendment
12/34/56
EX-10.69
from 10-K 7 pages Nt$80 Billion Syndicated Loan Second Amendment to the Syndicated Loan Agreement Micron Technology Taiwan, Inc. Micron Semiconductor Taiwan Co., Ltd
12/34/56
EX-10.68
from 10-Q 9 pages Second Amendment to the Credit Agreement Among Micron Technology, Inc., as Borrower and the Lenders Party Hereto, and Morgan Stanley Senior Funding, Inc., as Administrative Agent and as Collateral Agent Dated as of April 26, 2017 Jpmorgan Chase Bank, N.A., as Lead Arranger and Bookrunner Second Amendment
12/34/56
EX-10.63
from 10-Q 81 pages Nt$80 Billion Syndicated Loan Syndicated Loan Agreement Inotera Memories, Inc. Micron Semiconductor Taiwan Co., Ltd
12/34/56
EX-10.2
from 8-K 83 pages Credit Agreement Among Micron Technology, Inc., as Borrower and the Lenders Party Hereto, and Morgan Stanley Senior Funding, Inc., as Administrative Agent and as Collateral Agent Dated as of April 26, 2016 Morgan Stanley Senior Funding, Inc., Citigroup Global Markets Inc., Hsbc Securities (USA) Inc. and Jpmorgan Chase Bank, N.A., as Joint Lead Arrangers and Joint Bookrunners Merrill Lynch, Pierce, Fenner & Smith Incorporated, Credit Suisse Securities (USA) LLC, Dbs Bank Ltd. and Wells Fargo Securities, LLC as Co-Syndication Agents Ing Financial Markets LLC, Standard Chartered Bank, Australia and New Zealand Banking Group Limited Bnp Paribas Securities Corp., Crédit Agricole Corporate and Investment Bank, the Bank of Tokyo-Mitsubishi Ufj, Ltd., and U.S. Bank National Association as Co-Documentation Agents
12/34/56
EX-10.2
from 8-K 23 pages Registration Rights Agreement Dated February 3, 2015 Among Micron Technology, Inc. Goldman, Sachs & Co. Morgan Stanley & Co. LLC and Credit Suisse Securities (USA) LLC Registration Rights Agreement
12/34/56
EX-10.1
from 8-K 23 pages Registration Rights Agreement Dated July 28, 2014 Among Micron Technology, Inc. Morgan Stanley & Co. LLC Goldman, Sachs & Co. and Credit Suisse Securities (USA) LLC Registration Rights Agreement
12/34/56
EX-10.1
from 8-K 23 pages Registration Rights Agreement Dated February 10, 2014 Among Micron Technology, Inc. Morgan Stanley & Co. LLC Goldman, Sachs & Co. and Credit Suisse Securities (USA) LLC Registration Rights Agreement
12/34/56
EX-10.1
from 8-K 25 pages Loan Agreement
12/34/56
EX-10.80
from 10-Q 16 pages This Mortgage and Charge Agreement (The “Agreement”) Is Made on February 23, 2009 by and Among: (1) Economic Development Board, a Statutory Board Established in the Republic of Singapore Under the Economic Development Board Act, Chapter 85 of Singapore, Having Its Office at 250 North Bridge Road #28-00 Raffles City Tower Singapore 179101 (The “Board”); and (2) Micron Technology, Inc., a Company Incorporated in Delaware and Having Its Office at 8000 S. Federal Way, Boise, Idaho 83716 (Registration Number S91uf0404a) (The “Company”); and (3) Tech Semiconductor Singapore Pte. Ltd., a Company Incorporated in Singapore With Its Registered Office at 1 Woodlands Industrial Park D Street 1 Singapore 738799 (Company Registration Number 199102059c) (The “Subsidiary”). (Each, a “Party” and Together, the “Parties”) Whereas: (A) as at the Date of This Agreement, the Company Is the Legal and Beneficial Owner, Free From All Charges, Liens and Other Encumbrances, of 449,882,240 Issued and Paid Up Shares in the Capital of the Subsidiary. (B) by the Terms of That Certain Loan Agreement, Dated February 23, 2009, by Between the Board and the Company (The “Loan Agreement”), the Company Is Required to Execute This Agreement in Favour of the Board. (C) the Board, the Company and the Subsidiary Have Carefully Considered the Terms and Conditions of This Agreement and in Good Faith Agree to Enter Into This Agreement
12/34/56
EX-10.67
from 10-Q 16 pages Loan Agreement
12/34/56
EX-10.66
from 10-Q 24 pages [***] Denotes Confidential Materials Omitted and Filed Separately With the Securities and Exchange Commission Pursuant to a Request for Confidential Treatment Loan Agreement
12/34/56
EX-10.3
from 8-K 16 pages To: Micron Technology, Inc. 8000 S. Federal Bay Boise, Idaho 83716-9632 a/C: Ntpa: Yhnmp0 Credit Suisse International From: One Cabot Sqaure London E14 4qj England Re: Issuer Capped Share Call Option Transaction Ref. No: 53228855 Date: May 17, 2007 Dear Sir(s)
12/34/56
EX-10.2
from 8-K 16 pages To: Micron Technology, Inc. 8000 S. Federal Bay Boise, Idaho 83716-9632 a/C: Ntpa: Yhnmp0 Credit Suisse International From: One Cabot Sqaure London E14 4qj England Re: Issuer Capped Share Call Option Transaction Ref. No: 53228800 Date: May 17, 2007 Dear Sir(s)
12/34/56