Hoku Corp Watch

from 8-K 6 pages As an Inducement and Condition to the Lender’s Willingness to Provide a Term Credit Facility in an Aggregate Principal Amount of Up to $20,000,000 to Hoku on the Terms and Conditions Set Forth in the Credit Agreement, Hoku Requested Its Parent Company, Tianwei New Energy Holdings Co., Ltd. (“Tianwei”), and Tianwei Provided Cash Collateral of Approximately 106% of the Face Amount of the Letter of Credit in Renminbi (Rmb) (“Cash Collateral”) in Favor of the Issuing Bank as Security for the Reimbursement Obligations Now or Hereafter Arising From Draws Under the Letter of Credit (The “Tianwei Lc Obligations”). as a Continuing Inducement and Condition to the Lender’s Willingness to Extend the Maturity and Make Other Modifications With Respect to the Financing Provided Under the Credit Agreement, Tianwei Has Agreed to Extend the Term of the Letter of Credit and to Continue to Provide the Cash Collateral in Favor of the Issuing Bank to Secure the Tianwei Lc Obligations. Reimbursement Obligations

from 8-K 3 pages Amendment No. 1 to Credit Agreement

from 8-K 41 pages Credit Agreement Dated as of May 21, 2012 Between Hoku Corporation as Borrower, and China Merchants Bank Co., Ltd., New York Branch as Lender

from 8-K 6 pages As an Inducement and Condition to the Lender’s Willingness to Provide a Term Credit Facility in an Aggregate Principal Amount of Up to $10,000,000 to Hoku on the Terms and Conditions Set Forth in the Credit Agreement, Hoku Has Requested Its Parent Company, Tianwei New Energy Holdings Co., Ltd. (“Tianwei”), and Tianwei Has Agreed, to Provide Cash Collateral of 110% of the Face Amount of the Letter of Credit in Renminbi (Rmb) (“Cash Collateral”) in Favor of the Issuing Bank as Security for the Reimbursement Obligations Now or Hereafter Arising From Draws Under the Letter of Credit (The “Tianwei Lc Obligations”). Reimbursement Obligations

from 8-K 36 pages Credit Agreement Dated as of February 24, 2012 Between Hoku Corporation as Borrower, and China Merchants Bank Co., Ltd., New York Branch as Lender

from 8-K 36 pages Credit Agreement Dated as of January 11, 2012 Between Hoku Corporation as Borrower, and Industrial and Commercial Bank of China Limited, New York Branch as Lender

from 8-K 37 pages Credit Agreement Dated as of November 30, 2011 Between Hoku Corporation as Borrower, and Industrial and Commercial Bank of China Limited, New York Branch as Lender V

from 8-K 43 pages New York Branch Credit Agreeement Dated as of October 12, 2011 By, Between and Among Hoku Corporation and Hoku Materials, Inc. Collectively, as Borrower and Bank of China, New York Branch as Lender Usdlrs Twenty Two Million & One Hundred & Ten Thousand

from 8-K 37 pages Credit Agreement Dated as of October 5, 2011 Between Hoku Corporation as Borrower, and Industrial and Commercial Bank of China Limited, New York Branch as Lender Loan No. Nyla 2011016

from 8-K 34 pages Credit Agreement Dated as of September 1, 2011 Between Hoku Corporation as Borrower, and Industrial and Commercial Bank of China Limited, New York Branch as Lender

from 10-K 2 pages June 24, 2011 (I) Deliver the Letter of Credit by July 8th, 2011 in the Amount of $635,999.50. (II) Upon the Earlier of Successful Acceptance Testing at Hoku’s Facility in Pocatello, Idaho, and July 30, 2011, Hoku Shall Pay the Amount of $317,999.75 (The “Second Payment”). (III) Upon the Earlier of 6 Months After the Date of Commissioning and December 31, 2011, Hoku Shall Pay the Amount of $317,999.75 (The “Third Payment”)

from 8-K 34 pages Credit Agreement Dated as of June 2, 2011 Between Hoku Corporation as Borrower, and Industrial and Commercial Bank of China Limited, New York Branch as Lender

from 8-K/A 32 pages Credit Agreement Dated as of August 16, 2010 Between Hoku Corporation as Borrower, and China Merchants Bank Co., Ltd., New York Branch as Lender

from 8-K 34 pages Credit Agreement Dated as of April 6, 2011 Between Hoku Corporation as Borrower, and Industrial and Commercial Bank of China Limited, New York Branch as Lender

from 10-Q 37 pages Term Loan Credit Agreement Dated as of February 7, 2011 Between Hoku Corporation as Borrower, and Citic Bank International Limited, New York Branch as Lender

from 10-Q 3 pages Reference Is Made to the Credit Agreement (The “Credit Agreement”) Dated as of the Date Hereof Between Hoku Corporation, as Borrower (“HOKU”) and Industrial and Commercial Bank of China, Ltd., New York Branch, as Lender (The “Lender”). Capitalized Terms Used but Not Otherwise Defined Herein Shall Have the Meanings Ascribed to Them in the Credit Agreement

from 10-Q 34 pages Credit Agreement Dated as of January 10, 2011 Between Hoku Corporation as Borrower, and Industrial and Commercial Bank of China Limited, New York Branch as Lender

from 8-K 34 pages Credit Agreement Dated as of December 23, 2010 Between Hoku Corporation as Borrower, and Industrial and Commercial Bank of China Limited, New York Branch as Lender

from 8-K 20 pages Applicable Interest Margin 2.00% Per Annum (The “Margin”) Interest Rate Usd Libor Plus Applicable Margin. if in the Event Usd Libor Is Not Published for a Requested Twelve Month Interest Period, the Usd Libor Rate for Such Twelve-Month Period Shall Be Determined by the Bank. "Usd Libor" Means, in Relation to a Drawing or the Loan; (A) the Applicable Screen Rate; or (B) if No Screen Rate Is Available for Usd for the Interest Period of That Loan, the Arithmetic Mean of the Rates (Rounded Upwards to Four Decimal Places) as Quoted by Leading Banks in the London Interbank Market to the Bank at Its Request,

from 8-K 33 pages Credit Agreement Dated as of October 8, 2010 Between Hoku Corporation as Borrower, and China Merchants Bank Co., Ltd., New York Branch as Lender